TPS7A02: DSBGA package(footprint and land pattern) and schedule - Power management forum - Power management - TI E2E support forums
TN1074 - PCB Layout Recommendations for BGA Packages
BGA Land Pattern Design for Manufacturability
Die Size Ball Grid Array — PDSTE
BQ25101: Land pattern design - "Non-solder mask defined" for DSBGA and X2SON - Power management forum - Power management - TI E2E support forums
What's In Your BGA Land Pattern and Footprint | Zach Peterson | Component Creation | Altium Designer
AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AI)
Micron BGA Manufacturer's User Guide
NASA Guidelines for Ball Grid Array (BGA) and Die-Size BGA (DSBGA) Selection and Application
PCB Layout Recommendations for BGA Packages
BGA Component Package | mbedded.ninja
AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AI)
TN1074 - PCB Layout Recommendations for BGA Packages
TPS63050: TPS63050YFFR land pattern layout information - Power management forum - Power management - TI E2E support forums
BGA Land Pattern Design for Manufacturability
BGA Component Package | mbedded.ninja
BGA Component Package | mbedded.ninja
AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AI)
TN1074 - PCB Layout Recommendations for BGA Packages
Find all TI packages | Texas Instruments
DSBGA: Die Size Ball Grid Array, Die Size BGA | MADPCB
BGA Pad Size - PCB Libraries Forum
What's In Your BGA Land Pattern and Footprint | Zach Peterson | Component Creation | Altium Designer
AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)
